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Journal Articles

Physics-informed neural network for thermal analysis of space structure

Accepted Manuscript
Cheng Chang, Qinghua Zhou, Zhiqi Shi, Hao Zhu, Pu Li
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl.
Paper No: TSEA-24-1609
https://doi.org/10.1115/1.4068190
Published Online: March 12, 2025
View Article titled, Physics-informed neural network for thermal analysis of space structure
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Topics: Artificial neural networks, Physics, Space frame structures, Thermal analysis, Dynamic analysis, Heat flux, Boundary-value problems, Finite element methods, Aerospace industry, Deformation
Proceedings Papers

Effect of Powder Layer Thickness on Residual Stress in Laser Powder Bed Fusion of IN718

Elham Mirkoohi, Hong-Chuong Tran, Yu-Lung Lo, You-Cheng Chang, Hung-You Lin, Steven Y. Liang
Proc. ASME. MSEC2022, Volume 1: Additive Manufacturing; Biomanufacturing; Life Cycle Engineering; Manufacturing Equipment and Automation; Nano/Micro/Meso Manufacturing, V001T01A019, June 27–July 1, 2022
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2022-85391
https://doi.org/10.1115/MSEC2022-85391
View Paper titled, Effect of Powder Layer Thickness on Residual Stress in Laser Powder Bed Fusion of IN718
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Topics: Additive manufacturing, Lasers, Stress
Journal Articles

An Integrated Assisted History Matching and Embedded Discrete Fracture Model Workflow for Well Spacing Optimization in Shale Gas Reservoirs

Qiwei Li, Rui Yong, Jianfa Wu, Cheng Chang, Chuxi Liu, Wei Yu, Kamy Sepehrnoori, Jijun Miao
Journal: Journal of Energy Resources Technology
Publisher: ASME
Article Type: Research Papers
J. Energy Resour. Technol. July 2021, 143(7): 073004.
Paper No: JERT-20-1871
https://doi.org/10.1115/1.4050581
Published Online: April 22, 2021
View Article titled, An Integrated Assisted History Matching and Embedded Discrete Fracture Model Workflow for Well Spacing Optimization in Shale Gas Reservoirs
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Topics: Fracture (Materials), Fracture (Process), Optimization, Reservoirs, Shales, Water, Workflow, Simulation, Economic analysis, Permeability
Journal Articles

Empirical High Cycle Fatigue Assessment Model of MEMS Devices

Chia-Cheng Chang, Kuo-Ning Chiang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011005.
Paper No: EP-19-1027
https://doi.org/10.1115/1.4044278
Published Online: September 19, 2019
View Article titled, Empirical High Cycle Fatigue Assessment Model of MEMS Devices
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Topics: Design, Fatigue life, High cycle fatigue, Microelectromechanical systems, Silicon-on-insulator, Simulation, Stress, Torsion, Cycles, Damage
Journal Articles

New Closed-Form Thermal Boundary Layer Solutions in Shear Flow With Power-Law Velocity

Chang Yi Wang, Chien-Cheng Chang
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. June 2019, 141(6): 064502.
Paper No: HT-18-1352
https://doi.org/10.1115/1.4042489
Published Online: April 17, 2019
View Article titled, New Closed-Form Thermal Boundary Layer Solutions in Shear Flow With Power-Law Velocity
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Topics: Shear flow, Temperature, Thermal boundary layers, Forced convection, Heat, Boundary-value problems
Journal Articles

Development of a High Cycle Fatigue Life Prediction Model for Thin Film Silicon Structures

Chia-Cheng Chang, Sheng-Da Lin, Kuo-Ning Chiang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031008.
Paper No: EP-18-1004
https://doi.org/10.1115/1.4040297
Published Online: June 26, 2018
View Article titled, Development of a High Cycle Fatigue Life Prediction Model for Thin Film Silicon Structures
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Topics: Stress, High cycle fatigue, Displacement, Silicon, Thin films, Fatigue life
Proceedings Papers

Analysis and Evaluation of Readiness, Retention and Completion by Intensive Engineering Readiness Summer Program

Yong Zhou, Cheng-Chang (Sam) Pan, Nazmul Islam
Proc. ASME. IMECE2016, Volume 5: Education and Globalization, V005T06A011, November 11–17, 2016
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2016-67621
https://doi.org/10.1115/IMECE2016-67621
View Paper titled, Analysis and Evaluation of Readiness, Retention and Completion by Intensive Engineering Readiness Summer Program
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Topics: Statistics, Undergraduate students, Women engineers
Proceedings Papers

Evaluation of Engineering Readiness and Active Rate Enhanced by Intensive Summer Bridge Program

Yong Zhou, Cheng-Chang (Sam) Pan, Nazmul Islam
Proc. ASME. IMECE2015, Volume 5: Education and Globalization, V005T05A033, November 13–19, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2015-53262
https://doi.org/10.1115/IMECE2015-53262
View Paper titled, Evaluation of Engineering Readiness and Active Rate Enhanced by Intensive Summer Bridge Program
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Topics: Bridges (Structures), Students, Mathematics, Algebra, Education, Engineering design, Engineering mathematics, Engineering students, Undergraduate students, Workshops (Work spaces)
Proceedings Papers

Shorten the Math Gap for Pre-Engineering Students With Intensive Summer Bridge Program

Yong Zhou, Nazmul Islam, Cheng-Chang (Sam) Pan, Sanjay Kumar
Proc. ASME. IMECE2014, Volume 5: Education and Globalization, V005T05A014, November 14–20, 2014
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2014-40249
https://doi.org/10.1115/IMECE2014-40249
View Paper titled, Shorten the Math Gap for Pre-Engineering Students With Intensive Summer Bridge Program
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Topics: Bridges (Structures), Mathematics, Students, Engineering students, Algebra, Statistics
Proceedings Papers

High Pressure On-Chip Valves for Thermoplastic Microfluidics

Chien-Fu Chen, Jikun Liu, Chien-Cheng Chang, Don L. DeVoe
Proc. ASME. IMECE2009, Volume 12: Micro and Nano Systems, Parts A and B, 471-474, November 13–19, 2009
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2009-11760
https://doi.org/10.1115/IMECE2009-11760
View Paper titled, High Pressure On-Chip Valves for Thermoplastic Microfluidics
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Topics: High pressure (Physics), Microfluidics, Valves, Plasma desorption mass spectrometry, Contamination, Flow (Dynamics), Leakage, Manufacturing, Needles, Pressure
Proceedings Papers

Isoelectric Focusing-Reversed Phase Liquid Chromatography Polymer Microchip With Integrated High-Pressure Valves

Jikun Liu, Chien-Fu Chen, Chien-Cheng Chang, Don L. DeVoe
Proc. ASME. IMECE2009, Volume 12: Micro and Nano Systems, Parts A and B, 961-963, November 13–19, 2009
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2009-12147
https://doi.org/10.1115/IMECE2009-12147
View Paper titled, Isoelectric Focusing-Reversed Phase Liquid Chromatography Polymer Microchip With Integrated High-Pressure Valves
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Topics: High pressure (Physics), Integrated circuits, Polymers, Valves, Dimensions, Separation (Technology), Mass spectrometry
Proceedings Papers

Application of an Accuracy Enhancement Module for Precision Machine Tools by Spatial Error Compensation

Fu-Chuan Hsu, Cheng-Chang Chiu, Yu-Ting Lyu, Wen-Long Chang, Junz J.-J. Wang, Yung-Yuan Liao, Steven Y. Liang
Proc. ASME. MSEC2008, ASME 2008 International Manufacturing Science and Engineering Conference, Volume 2, 251-256, October 7–10, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MSEC_ICM&P2008-72177
https://doi.org/10.1115/MSEC_ICMP2008-72177
View Paper titled, Application of an Accuracy Enhancement Module for Precision Machine Tools by Spatial Error Compensation
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Topics: Error compensation, Machine tools, Errors, Computer numerical control machine tools, Lasers, Algorithms, Computer-aided design, Control equipment, Interferometers
Proceedings Papers

3-D Lithography by CCFL Exposure

Zong-Ting Yuan, Cheng-Chang Lee, Horng-Jou Wang, Heng-Chung Chang, Huang-Kun Chen, Tai-Kang Shing
Proc. ASME. IMECE2007, Volume 3: Design and Manufacturing, 393-397, November 11–15, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2007-41733
https://doi.org/10.1115/IMECE2007-41733
View Paper titled, 3-D Lithography by CCFL Exposure
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Topics: Lithography, Manufacturing, Etching, Machining, Metals, Microfabrication, Surface roughness
Proceedings Papers

A New Surface Modification Method to Alleviate Stiction of Microstructures

Cheng-Chang Lee, Wensyang Hsu
Proc. ASME. IMECE2002, Microelectromechanical Systems, 189-194, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39299
https://doi.org/10.1115/IMECE2002-39299
View Paper titled, A New Surface Modification Method to Alleviate Stiction of Microstructures
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Topics: Reactive-ion etching, Stiction, Surface roughness
Journal Articles

Stability Analysis of Piezoelectric Circular Cylindrical Shells

Cheng Chang-qing, Shen Ya-peng
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Technical Papers
J. Appl. Mech. December 1997, 64(4): 847–852.
https://doi.org/10.1115/1.2788991
Published Online: December 1, 1997
View Article titled, Stability Analysis of Piezoelectric Circular Cylindrical Shells
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Topics: Circular cylindrical shells, Stability, Buckling, Electric fields, Shells, Stress, External pressure, Piezoelectricity