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Proceedings Papers

Assessment of Effect of Operating Temperature on SAC-R Solders at High Strain Rates After Prolonged Storage

Pradeep Lall, Mrinmoy Saha, Jeff Suhling, David Locker
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A011, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112036
https://doi.org/10.1115/IPACK2023-112036
View Paper titled, Assessment of Effect of Operating Temperature on SAC-R Solders at High Strain Rates After Prolonged Storage
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Topics: Operating temperature, Solders, Storage, Alloys, Constitutive equations, Shock (Mechanics), Temperature, Aerospace industry, Automobiles, Climate
Proceedings Papers

Study of Sustained High-Temperature on the Reliability of Lead-Free Solder Joint Assemblies Under Vibration

Pradeep Lall, Vishal Mehta, Jeff Suhling, David Locker
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A009, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111984
https://doi.org/10.1115/IPACK2023-111984
View Paper titled, Study of Sustained High-Temperature on the Reliability of Lead-Free Solder Joint Assemblies Under Vibration
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Topics: Finite element analysis, High temperature, Lead-free solders, Reliability, Solders, Temperature, Testing, Vibration, Viscoplasticity
Journal Articles

Leadfree SnAgCu Solder Materials Characterization at High Strain Rates at Low Test Temperatures and Drop and Shock Simulation Using Input-G Method

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021004.
Paper No: EP-22-1026
https://doi.org/10.1115/1.4062868
Published Online: November 10, 2023
View Article titled, Leadfree SnAgCu Solder Materials Characterization at High Strain Rates at Low Test Temperatures and Drop and Shock Simulation Using Input-G Method
Open the PDF for Leadfree SnAgCu Solder Materials Characterization at High Strain Rates at Low Test Temperatures and Drop and Shock Simulation Using Input-G Method in another window
Topics: Solders, Temperature, Shock (Mechanics), Alloys
Proceedings Papers

Effect of Property Evolution of Doped and Undoped SnAgCu Solder Alloys Under Shock and Vibration

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97452
https://doi.org/10.1115/IPACK2022-97452
View Paper titled, Effect of Property Evolution of Doped and Undoped SnAgCu Solder Alloys Under Shock and Vibration
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Topics: Alloys, Shock (Mechanics), Solders, Vibration, Reliability, Aerospace industry, Climate, Defense industry, Elastic moduli, Electronics
Journal Articles

Evolution of Anand Parameters for Thermally Aged Sn-Ag-Cu Lead-Free Alloys at Low Operating Temperature

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021116.
Paper No: EP-21-1062
https://doi.org/10.1115/1.4053764
Published Online: March 11, 2022
View Article titled, Evolution of Anand Parameters for Thermally Aged Sn-Ag-Cu Lead-Free Alloys at Low Operating Temperature
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Topics: Solders, Stress-strain curves, Temperature, Alloys, Operating temperature, Tensile strength, Materials properties
Proceedings Papers

Low Temperature Material Characterization of Lead-Free SAC Solder Alloy at High Strain Rate After Prolonged High Temperature Storage

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A021, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74068
https://doi.org/10.1115/IPACK2021-74068
View Paper titled, Low Temperature Material Characterization of Lead-Free SAC Solder Alloy at High Strain Rate After Prolonged High Temperature Storage
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Topics: Alloys, High temperature, Low temperature materials, Solders, Storage
Proceedings Papers

Evolution of Anand Parameters With Elevated Temperature Aging for SAC Leadfree Alloys

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2658
https://doi.org/10.1115/IPACK2020-2658
View Paper titled, Evolution of Anand Parameters With Elevated Temperature Aging for SAC Leadfree Alloys
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Topics: Alloys, Temperature, Operating temperature, Solders, Avionics, Constitutive equations, Electronic equipment, Electronics, Energy dissipation, Engines
Journal Articles

Evolution of Anand Parameters With Elevated Temperature Aging for SnAgCu Lead-free Alloys

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 021005.
Paper No: EP-20-1080
https://doi.org/10.1115/1.4048181
Published Online: October 8, 2020
View Article titled, Evolution of Anand Parameters With Elevated Temperature Aging for SnAgCu Lead-free Alloys
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Topics: Alloys, Solders, Temperature, Stress, Solder joints, Operating temperature
Journal Articles

High Strain Rate Mechanical Properties of SAC-Q With Sustained Elevated Temperature Storage at 100 °C

Pradeep Lall, Vishal Mehta, Jeff Suhling, David Locker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041104.
Paper No: EP-20-1003
https://doi.org/10.1115/1.4047392
Published Online: June 23, 2020
View Article titled, High Strain Rate Mechanical Properties of SAC-Q With Sustained Elevated Temperature Storage at 100 °C
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Topics: Elastic moduli, Mechanical properties, Stress, Temperature, Tensile strength, Storage, Solders
Proceedings Papers

High Strain Rate Mechanical Properties of SAC-Q With Sustained Elevated Temperature Storage at 100°C

Pradeep Lall, Vishal Mehta, Jeff Suhling, David Locker
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A011, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6576
https://doi.org/10.1115/IPACK2019-6576
View Paper titled, High Strain Rate Mechanical Properties of SAC-Q With Sustained Elevated Temperature Storage at 100°C
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Topics: Mechanical properties, Storage, Temperature, Alloys, Operating temperature, Electronic components, Electronics, High temperature, Lead-free solders, Shock (Mechanics)
Proceedings Papers

Evolution of Anand Parameters With Elevated Temperature Aging for SAC Leadfree Alloys

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A027, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6577
https://doi.org/10.1115/IPACK2019-6577
View Paper titled, Evolution of Anand Parameters With Elevated Temperature Aging for SAC Leadfree Alloys
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Topics: Alloys, Temperature, Lead-free solders, Solders, Finite element analysis, Avionics, Constitutive equations, Density, Electronic components, Electronics
Proceedings Papers

Viscoplastic Constitutive Model for High Strain Rate Mechanical Properties of SAC-Q Leadfree Solder After High-Temperature Prolonged Storage

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A005, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8357
https://doi.org/10.1115/IPACK2018-8357
View Paper titled, Viscoplastic Constitutive Model for High Strain Rate Mechanical Properties of SAC-Q Leadfree Solder After High-Temperature Prolonged Storage
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Topics: Constitutive equations, High temperature, Lead-free solders, Mechanical properties, Storage, Solders, Alloys, Drilling, Electronics, Geometry
Proceedings Papers

Anand Parameters for SAC305 Alloys After Prolonged Storage up to 1-Year

Pradeep Lall, Di Zhang, Jeff Suhling, David Locker
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A009, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74300
https://doi.org/10.1115/IPACK2017-74300
View Paper titled, Anand Parameters for SAC305 Alloys After Prolonged Storage up to 1-Year
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Topics: Alloys, Storage, High temperature, Solders, Temperature, Deformation, Electronics, Operating temperature, Constitutive equations, Elastic moduli
Proceedings Papers

Effects of Sustained Exposure to Temperature and Humidity on the Reliability and Performance of MEMS Microphone

Pradeep Lall, Amrit Abrol, David Locker
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A022, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74252
https://doi.org/10.1115/IPACK2017-74252
View Paper titled, Effects of Sustained Exposure to Temperature and Humidity on the Reliability and Performance of MEMS Microphone
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Topics: Microelectromechanical systems, Microphones, Reliability, Temperature, High temperature, Service life (Equipment), Analytical methods, Engineers, Failure analysis, Failure mechanisms
Proceedings Papers

Anand Viscoplasticity Model for the Effect of Aging on Mechanical Behavior of SAC305 Operating at High Strain Rate and High Temperature

Pradeep Lall, Di Zhang, Jeff Suhling, David Locker
Proc. ASME. IMECE2015, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A023, November 13–19, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2015-53751
https://doi.org/10.1115/IMECE2015-53751
View Paper titled, Anand Viscoplasticity Model for the Effect of Aging on Mechanical Behavior of SAC305 Operating at High Strain Rate and High Temperature
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Topics: High temperature, Mechanical behavior, Viscoplasticity, Solders, Temperature, Deformation, Operating temperature, Storage, Electronics, Constitutive equations
Proceedings Papers

A Study on the Evolution of the High Strain Rate Mechanical Properties of SAC105 Leadfree Alloy at High Operating Temperatures

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A001, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48389
https://doi.org/10.1115/IPACK2015-48389
View Paper titled, A Study on the Evolution of the High Strain Rate Mechanical Properties of SAC105 Leadfree Alloy at High Operating Temperatures
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Topics: Alloys, Mechanical properties, Operating temperature, Temperature, Electronic systems, Solders, Vibration, Deformation, Elastic moduli, Electronics
Journal Articles

Stress–Strain Behavior of SAC305 at High Strain Rates

Pradeep Lall, Sandeep Shantaram, Jeff Suhling, David Locker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2015, 137(1): 011010.
Paper No: EP-14-1001
https://doi.org/10.1115/1.4028641
Published Online: March 1, 2015
View Article titled, Stress–Strain Behavior of SAC305 at High Strain Rates
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Topics: Deformation, Displacement, Failure, Finite element analysis, Finite element model, Lead-free solders, Manufacturing, Solders, Stress, Trusses (Building)
Proceedings Papers

Mechanical Behavior of Sn1Ag0.5Cu and Sn3Ag0.5Cu Alloys at High Strain Rates

Pradeep Lall, Sandeep Shantaram, Jeff Suhling, David Locker
Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 491-505, November 9–15, 2012
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2012-93059
https://doi.org/10.1115/IMECE2012-93059
View Paper titled, Mechanical Behavior of Sn1Ag0.5Cu and Sn3Ag0.5Cu Alloys at High Strain Rates
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Topics: Alloys, Mechanical behavior, Shock (Mechanics), Vibration, Electronics, Solders, Failure, Stress, Damage, High temperature