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H. Alan Mantooth
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Journal Articles

Point-Contact Bonding of Integrated Three-Dimensional Manifold Microchannel Cooling Within Direct Bonded Copper Platform

Yujui Lin, Tiwei Wei, Wyatt Jason Moy, Hao Chen, Man Prakash Gupta, Michael Degner, Mehdi Asheghi, H. Alan Mantooth, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021003.
Paper No: EP-22-1092
https://doi.org/10.1115/1.4062924
Published Online: September 20, 2023
View Article titled, Point-Contact Bonding of Integrated Three-Dimensional Manifold Microchannel Cooling Within Direct Bonded Copper Platform
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Topics: Bonding, Copper, Microchannels, Polishing, Manifolds, Solders
Journal Articles

Multi-Level Embedded Three-Dimensional Manifold Microchannel Heat Sink of Aluminum Nitride Direct Bonded Copper for the High-Power Electronic Module

Yujui Lin, Tiwei Wei, Wyatt Jason Moy, Hao Chen, Man Prakash Gupta, Michael Degner, Mehdi Asheghi, H. Alan Mantooth, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011006.
Paper No: EP-22-1093
https://doi.org/10.1115/1.4062384
Published Online: June 7, 2023
View Article titled, Multi-Level Embedded Three-Dimensional Manifold Microchannel Heat Sink of Aluminum Nitride Direct Bonded Copper for the High-Power Electronic Module
Open the PDF for Multi-Level Embedded Three-Dimensional Manifold Microchannel Heat Sink of Aluminum Nitride Direct Bonded Copper for the High-Power Electronic Module in another window
Topics: Manifolds, Microchannels, Pressure drop, Flow (Dynamics), Thermal resistance, Cooling, Computational fluid dynamics
Proceedings Papers

3D Wire Bondless Integration: The Future of Silicon Carbide (SiC) Packaging

Sayan Seal, Andrea K. Wallace, John E. Zumbro, H. Alan Mantooth
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A015, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74213
https://doi.org/10.1115/IPACK2017-74213
View Paper titled, 3D Wire Bondless Integration: The Future of Silicon Carbide (SiC) Packaging
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Topics: Packaging, Silicon, Wire, MOSFET transistors, Bonding, Electromagnetic interference, Electronics, Energy gap, Flip-chip, High temperature