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Journal Articles

The Research for Quickly Measuring the Diameter and Roundness of Solder Balls Based on Machine Vision Technology

Tongju Wang, Yahao Liu, Wenqian Zhang, Yongping Lei, Jian Lin, Hanguang Fu, Zipeng Lin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021010.
Paper No: EP-23-1059
https://doi.org/10.1115/1.4063918
Published Online: December 11, 2023
View Article titled, The Research for Quickly Measuring the Diameter and Roundness of Solder Balls Based on Machine Vision Technology
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Topics: Solders, Machinery