Skip Nav Destination
Close Modal
Update search
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
NARROW
Format
Publisher
Journal
Article Type
Conference Series
Subject Area
Topics
Date
Availability
1-20 of 91
Kenneth E. Goodson
Close
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
1
Sort by
Journal Articles
Yujui Lin, Tiwei Wei, Wyatt Jason Moy, Hao Chen, Man Prakash Gupta, Michael Degner, Mehdi Asheghi, H. Alan Mantooth, Kenneth E. Goodson
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021003.
Paper No: EP-22-1092
Published Online: September 20, 2023
Journal Articles
Yujui Lin, Tiwei Wei, Wyatt Jason Moy, Hao Chen, Man Prakash Gupta, Michael Degner, Mehdi Asheghi, H. Alan Mantooth, Kenneth E. Goodson
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011006.
Paper No: EP-22-1093
Published Online: June 7, 2023
Journal Articles
Tiwei Wei, Sougata Hazra, Yujui Lin, Man Prakash Gupta, Michael Degner, Mehdi Asheghi, Kenneth E. Goodson
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021008.
Paper No: EP-22-1046
Published Online: September 28, 2022
Proceedings Papers
Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 181-190, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0956
Proceedings Papers
Proc. ASME. IMECE99, Heat Transfer: Volume 3, 41-49, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-1061
Proceedings Papers
Proc. ASME. IMECE99, Micro-Electro-Mechanical Systems (MEMS), 583-588, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0324
Proceedings Papers
Proc. ASME. IMECE99, Micro-Electro-Mechanical Systems (MEMS), 575-582, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0323
Proceedings Papers
Farid Soroush, Tanya Liu, Qianying Wu, Mehdi Asheghi, Kenneth E. Goodson, Lorenz Marco, Egger Christian, Rittner Martin
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A010, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73334
Topics:
Copper
Proceedings Papers
Farid Soroush, Tanya Liu, Qianying Wu, Chi Zhang, Mehdi Asheghi, Kenneth E. Goodson, Lorenz Marco, Egger Christian, Rittner Martin
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A001, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73309
Proceedings Papers
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 51-57, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/HTD-24377
Proceedings Papers
Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 531-535, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/MEMS-23876
Proceedings Papers
Lian Zhang, Evelyn N. Wang, Jon D. Koch, Jonathan T. C. Liu, Jae-Mo Koo, Linan Jiang, Kenneth E. Goodson, Juan G. Santiago, Thomas W. Kenny
Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 135-140, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/MEMS-23820
Proceedings Papers
Lian Zhang, Jae-Mo Koo, Linan Jiang, Shilajeet S. Banerjee, Mehdi Ashegi, Kenneth E. Goodson, Juan G. Santiago, Thomas W. Kenny
Proc. ASME. IMECE2000, Micro-Electro-Mechanical Systems (MEMS), 129-135, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-1082
Journal Articles
Journal:
Applied Mechanics Reviews
Publisher: ASME
Article Type: Review Articles
Appl. Mech. Rev. January 2021, 73(1): 010802.
Paper No: AMR-20-1085
Published Online: February 18, 2021
Journal Articles
Ki Wook Jung, Eunho Cho, Hyoungsoon Lee, Chirag Kharangate, Feng Zhou, Mehdi Asheghi, Ercan M. Dede, Kenneth E. Goodson
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031117.
Paper No: EP-20-1030
Published Online: August 17, 2020
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031119.
Paper No: EP-20-1022
Published Online: August 17, 2020
Journal Articles
Ki Wook Jung, Sougata Hazra, Heungdong Kwon, Alisha Piazza, Edward Jih, Mehdi Asheghi, Man Prakash Gupta, Michael Degner, Kenneth E. Goodson
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031118.
Paper No: EP-20-1032
Published Online: August 17, 2020
Proceedings Papers
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A010, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6539
Proceedings Papers
Ki Wook Jung, Sougata Hazra, Heungdong Kwon, Alisha Piazza, Edward Jih, Mehdi Asheghi, Man Prakash Gupta, Mike Degner, Kenneth E. Goodson
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A021, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6472
Proceedings Papers
Ki Wook Jung, Hyoungsoon Lee, Chirag Kharangate, Feng Zhou, Mehdi Asheghi, Ercan M. Dede, Kenneth E. Goodson
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A007, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6400
1