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Journal Articles

A Comprehensive Study on Characterization of Residual Stress of Build-Up Layer and Prediction of Chip Warpage

Chongyang Cai, Huayan Wang, Junbo Yang, Pengcheng Yin, S. B Park
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021006.
Paper No: EP-23-1060
https://doi.org/10.1115/1.4063919
Published Online: November 23, 2023
View Article titled, A Comprehensive Study on Characterization of Residual Stress of Build-Up Layer and Prediction of Chip Warpage
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Topics: Stress, Warping, Temperature, Silicon
Proceedings Papers

Polarization Switching for Ferroelectric Materials

S. B. Park, S. S. Park, G. P. Carman, H. T. Hahn
Proc. ASME. IMECE96, Aerospace, 603-612, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0675
https://doi.org/10.1115/IMECE1996-0675
View Paper titled, Polarization Switching for Ferroelectric Materials
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Topics: Polarization (Electricity), Polarization (Light), Polarization (Waves), Fatigue, Interferometry, Microcracks, Piezoelectric ceramics, Shear (Mechanics)
Proceedings Papers

Design Guideline to Improve Thermal Management of 3D Package Using Cu-to-Cu Direct Bonding

Ah-Young Park, S. B. Park
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A066, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48042
https://doi.org/10.1115/IPACK2015-48042
View Paper titled, Design Guideline to Improve Thermal Management of 3D Package Using Cu-to-Cu Direct Bonding
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Topics: Bonding, Design, Thermal management, Finite element analysis, Packaging, Solders, Dimensions, Energy consumption, Heat transfer, Integrated circuits
Proceedings Papers

A Numerical Methodology for Thermo-Mechanical Characterization of High Power Electronic Packages

S. B. Park, T. T. Nguyen, N. S. Goo
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 357-364, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-39755
https://doi.org/10.1115/IMECE2010-39755
View Paper titled, A Numerical Methodology for Thermo-Mechanical Characterization of High Power Electronic Packages
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Topics: Electronic packages, Thermomechanics, Computational fluid dynamics, Finite element methods, Simulation, Temperature distribution, Transients (Dynamics), Forced convection, Heat flux, Heat sinks
Proceedings Papers

Effect of Compressive Loading on the Interconnect Reliability Under Thermal Cycling

Da Yu, Tung Nguyen, Ho H. Lee, Namseo Goo, S. B. Park
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 603-608, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52232
https://doi.org/10.1115/IPACK2011-52232
View Paper titled, Effect of Compressive Loading on the Interconnect Reliability Under Thermal Cycling
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Topics: Reliability, Heat, Heat sinks, Power density, Solder joints, Circuits, Computer simulation, Cycles, Energy dissipation, Experimental methods
Journal Articles

Comparative Studies on Solder Joint Reliability of Plastic and Ceramic Ball Grid Array Packages of the Same Form Factor Under Power and Accelerated Thermal Cycling

S. B. Park, Rahul Joshi, Izhar Ahmed, Soonwan Chung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2008, 130(4): 041004.
https://doi.org/10.1115/1.2993146
Published Online: November 17, 2008
View Article titled, Comparative Studies on Solder Joint Reliability of Plastic and Ceramic Ball Grid Array Packages of the Same Form Factor Under Power and Accelerated Thermal Cycling
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Topics: Ball-Grid-Array packages, Ceramics, Computational fluid dynamics, Deformation, Finite element analysis, Flip-chip devices, Interferometry, Manufacturing, Reliability, Solder joints
Journal Articles

Measurement of Transient Dynamic Response of Circuit Boards of a Handheld Device During Drop Using 3D Digital Image Correlation

S. B. Park, Chirag Shah, Jae B. Kwak, Changsoo Jang, Soonwan Chung, James M. Pitarresi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2008, 130(4): 044502.
https://doi.org/10.1115/1.3000097
Published Online: November 17, 2008
View Article titled, Measurement of Transient Dynamic Response of Circuit Boards of a Handheld Device During Drop Using 3D Digital Image Correlation
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Topics: Accelerometers, Deformation, Dynamic response, Printed circuit boards, Strain gages, Transients (Dynamics), Lumber, Displacement
Proceedings Papers

The Role of Intermetallics in Electromigration in Solder Pumps for Lead Free Solder Structure and Its Solder Pad Combination

S. B. Park, Ganesh R. Iyer
Proc. ASME. IMECE2004, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 271-279, November 13–19, 2004
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2004-62494
https://doi.org/10.1115/IMECE2004-62494
View Paper titled, The Role of Intermetallics in Electromigration in Solder Pumps for Lead Free Solder Structure and Its Solder Pad Combination
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Topics: Electrodiffusion, Intermetallic compounds, Lead-free solders, Pumps, Solders, Failure, Flip-chip, Flip-chip devices, Bonding agents, Metallurgy
Proceedings Papers

Structural Reliability of SU-8 Material for MEMS Application

S. B. Park, Soonwan Chung, Sandeep Makhar, Harold Ackler, Pinyen Lin
Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 251-258, November 5–11, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2005-82647
https://doi.org/10.1115/IMECE2005-82647
View Paper titled, Structural Reliability of SU-8 Material for MEMS Application
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Topics: Bone, Computer simulation, Deflection, Elastic moduli, Failure analysis, Fatigue, Finite element analysis, Fracture toughness, Mechanical properties, Membranes
Journal Articles

Shorter Field Life in Power Cycling for Organic Packages

S. B. Park, Izhar Z. Ahmed
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 28–34.
https://doi.org/10.1115/1.2429706
Published Online: May 1, 2006
View Article titled, Shorter Field Life in Power Cycling for Organic Packages
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Topics: Computational fluid dynamics, Finite element analysis, Flip-chip devices, Manufacturing, Reliability, Solders, Temperature, Ball-Grid-Array packaging, Structural analysis, Cycles
Journal Articles

Measuring Strain Distribution During Mesoscopic Domain Reorientation in a Ferroelectric Material

S. B. Park, S. S. Park, G. P. Carman, H. T. Hahn
Journal: Journal of Engineering Materials and Technology
Publisher: ASME
Article Type: Technical Papers
J. Eng. Mater. Technol. January 1998, 120(1): 1–6.
https://doi.org/10.1115/1.2806833
Published Online: January 1, 1998
View Article titled, Measuring Strain Distribution During Mesoscopic Domain Reorientation in a Ferroelectric Material
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Topics: Fatigue, Interferometry, Mesoscopic systems, Microcracks, Piezoelectric ceramics, Polarization (Electricity), Polarization (Light), Polarization (Waves), Shear (Mechanics), Strain measurement
Journal Articles

Minimizing Stress Levels in Piezoelectric Media Containing Elliptical Voids

S. B. Park, G. P. Carman
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Technical Papers
J. Appl. Mech. September 1997, 64(3): 466–470.
https://doi.org/10.1115/1.2788916
Published Online: September 1, 1997
View Article titled, Minimizing Stress Levels in Piezoelectric Media Containing Elliptical Voids
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Topics: Stress, Deformation, Fracture (Materials), Geometry, Materials properties, Mathematics