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1-7 of 7
Xuhui Feng
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Journal Articles
Automotive Silicon Carbide Power Module Cooling With a Novel Modular Manifold and Embedded Heat Sink
Ammar Osman, Gilberto Moreno, Steve Myers, Joshua Major, Xuhui Feng, Sreekant V. J. Narumanchi, Yogendra Joshi
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021007.
Paper No: EP-23-1026
Published Online: December 6, 2023
Proceedings Papers
Gilberto Moreno, Joshua Major, Douglas DeVoto, Faisal Khan, Sreekant Narumanchi, Xuhui Feng, Paul Paret
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A003, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97283
Proceedings Papers
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A004, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97355
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011004.
Paper No: EP-20-1093
Published Online: August 6, 2021
Proceedings Papers
Bidzina Kekelia, Kevin Bennion, Xuhui Feng, Gilberto Moreno, J. Emily Cousineau, Sreekant Narumanchi, Jeff Tomerlin
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A004, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6457
Proceedings Papers
Proc. ASME. MNHMT2009, ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer, Volume 2, 265-270, December 18–21, 2009
Publisher: American Society of Mechanical Engineers
Paper No: MNHMT2009-18201
Proceedings Papers
Proc. ASME. MNC2007, First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B, 1461-1470, January 10–13, 2007
Publisher: American Society of Mechanical Engineers
Paper No: MNC2007-21425