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Journal Articles

Using Multiscale Atmospheric Modeling to Explore the Impact of Surface Albedo on Anthropogenic Heat Release

Shuv Dey, Evan Mallen, Brian Stone, Jr., Yogendra Joshi
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. May 2024, 146(5): 052901.
Paper No: HT-23-1465
https://doi.org/10.1115/1.4065088
Published Online: April 3, 2024
View Article titled, Using Multiscale Atmospheric Modeling to Explore the Impact of Surface Albedo on Anthropogenic Heat Release
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Topics: Albedo, Cities, Heat, Large eddy simulation, Simulation, Temperature, Modeling, Heat flux, Boundary-value problems, Microscale devices
Journal Articles

Thermal Characterization of Subcooled Flow Boiling in a Pin-Fin Coldplate With Non-Uniform Heating

Ammar Osman, Yogendra Joshi
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. May 2024, 146(5): 051602.
Paper No: HT-23-1474
https://doi.org/10.1115/1.4064709
Published Online: March 7, 2024
View Article titled, Thermal Characterization of Subcooled Flow Boiling in a Pin-Fin Coldplate With Non-Uniform Heating
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Topics: Flow (Dynamics), Heat, Heating, Heat flux, Boiling, Subcooling, Temperature
Journal Articles

Automotive Silicon Carbide Power Module Cooling With a Novel Modular Manifold and Embedded Heat Sink

Ammar Osman, Gilberto Moreno, Steve Myers, Joshua Major, Xuhui Feng, Sreekant V. J. Narumanchi, Yogendra Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021007.
Paper No: EP-23-1026
https://doi.org/10.1115/1.4062869
Published Online: December 6, 2023
View Article titled, Automotive Silicon Carbide Power Module Cooling With a Novel Modular Manifold and Embedded Heat Sink
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Journal Articles

Evaluation and Validation of Microscale Atmospheric Modeling With Offline Weather Research and Forecasting Model to Parallelized Large-Eddy Simulation Model Forcing Conditions

Shuv Dey, Evan Mallen, Brian Stone, Jr., Yogendra Joshi
Journal: ASME Journal of Engineering for Sustainable Buildings and Cities
Publisher: ASME
Article Type: Research Papers
J. Eng. Sustain. Bldgs. Cities. February 2023, 4(1): 011003.
Paper No: JESBC-22-1016
https://doi.org/10.1115/1.4062112
Published Online: April 3, 2023
View Article titled, Evaluation and Validation of Microscale Atmospheric Modeling With Offline Weather Research and Forecasting Model to Parallelized Large-Eddy Simulation Model Forcing Conditions
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Topics: Boundary-value problems, Cities, Flow (Dynamics), Heat, Large eddy simulation, Microscale devices, Modeling, Simulation, Temperature, Turbulence
Journal Articles

Special Issue: Ivan Catton Memorial Issue — Innovations and Advancements in Heat & Mass Transfer: Part I

Yogesh Jaluria, Yogendra Joshi, Antonio Barletta, Vijay Dhir
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Guest Editorial
J. Heat Mass Transfer. March 2023, 145(3): 030301.
Paper No: HT-22-1813
https://doi.org/10.1115/1.4056684
Published Online: February 6, 2023
View Article titled, Special Issue: Ivan Catton Memorial Issue — Innovations and Advancements in Heat & Mass Transfer: Part I
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Topics: Heat, Innovation, Mass transfer, Engineering teachers, Heat transfer
Journal Articles

Flow Boiling in Flexible Polymer Microgaps for Embedded Cooling in High-Power Applications

Daniel Lorenzini, Wenming Li, Yogendra Joshi
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. April 2023, 145(4): 041603.
Paper No: HT-22-1470
https://doi.org/10.1115/1.4056594
Published Online: February 3, 2023
View Article titled, Flow Boiling in Flexible Polymer Microgaps for Embedded Cooling in High-Power Applications
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Topics: Boiling, Cooling, Flow (Dynamics), Fluids, Plasma desorption mass spectrometry, Vapors, Temperature, Computer simulation, Computational fluid dynamics, Heat
Proceedings Papers

Data Driven Modeling Advancements for Thermal Predictions in Data Center Applications

Dhaval Patel, Yogendra Joshi
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A015, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97478
https://doi.org/10.1115/IPACK2022-97478
View Paper titled, Data Driven Modeling Advancements for Thermal Predictions in Data Center Applications
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Topics: Data centers, Modeling, Transients (Dynamics)
Journal Articles

Recent Progress and Challenges in Microscale Urban Heat Modeling and Measurement for Urban Engineering Applications

Shuv Dey, Yogendra Joshi
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Review Articles
J. Thermal Sci. Eng. Appl. January 2023, 15(1): 010801.
Paper No: TSEA-22-1328
https://doi.org/10.1115/1.4056054
Published Online: November 10, 2022
View Article titled, Recent Progress and Challenges in Microscale Urban Heat Modeling and Measurement for Urban Engineering Applications
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Topics: Cities, Heat, Modeling, Microscale devices
Journal Articles

Development and Validation of a Transient Heat Transfer Model for Evaluating Thermal Management Solutions for Packaging Next-Generation Smart City Infrastructure Devices

Shuv Dey, Luis Diego Monge Jimenez, J. Michael Brown, Yogendra Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021004.
Paper No: EP-22-1038
https://doi.org/10.1115/1.4055094
Published Online: August 18, 2022
View Article titled, Development and Validation of a Transient Heat Transfer Model for Evaluating Thermal Management Solutions for Packaging Next-Generation Smart City Infrastructure Devices
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Topics: Climate, Design, Solar energy, Temperature, Thermal management, Transients (Dynamics), Solar radiation, Smart cities, Computer simulation, Cycles
Journal Articles

Validation and Parametric Investigations of an Internal Permanent Magnet Motor Using a Lumped Parameter Thermal Model

Sebastien Sequeira, Kevin Bennion, J. Emily Cousineau, Sreekant Narumanchi, Gilbert Moreno, Satish Kumar, Yogendra Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021114.
Paper No: EP-21-1052
https://doi.org/10.1115/1.4053121
Published Online: February 7, 2022
View Article titled, Validation and Parametric Investigations of an Internal Permanent Magnet Motor Using a Lumped Parameter Thermal Model
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Topics: Engines, Finite element analysis, Lamination, Motors, Stators, Temperature, Thermal conductivity, Winding (process), Sensitivity analysis, Contact resistance
Proceedings Papers

MEMS-Based Test Structures for IC Technology

Stephen A. Smee, Michael Gaitan, Yogendra Joshi
Proc. ASME. IMECE98, Mechanical Behavior of Advanced Materials, 147-149, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-1151
https://doi.org/10.1115/IMECE1998-1151
View Paper titled, MEMS-Based Test Structures for IC Technology
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Topics: Delamination, Density, Electrodiffusion, Failure, Integrated circuits, Microelectromechanical systems, Probability, Reliability, Stress, Thermomechanics
Journal Articles

Compact Transient Thermal Model of Microfluidically Cooled Three-Dimensional Stacked Chips With Pin-Fin Enhanced Microgap

Yuanchen Hu, Md Obaidul Hossen, Zhimin Wan, Muhannad S. Bakir, Yogendra Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031007.
Paper No: EP-20-1045
https://doi.org/10.1115/1.4049814
Published Online: February 19, 2021
View Article titled, Compact Transient Thermal Model of Microfluidically Cooled Three-Dimensional Stacked Chips With Pin-Fin Enhanced Microgap
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Topics: Computational fluid dynamics, Cooling, Integrated circuits, Leakage, Simulation, Temperature, Transients (Dynamics), Fins, Steady state, Heat
Journal Articles

Parametric Analysis of Microfluidic Cooling Systems for Three-Dimensional-Stacked Silicon Microelectronics by Inferential Statistic Approaches

Tomas Moreno-Torres, Daniel Lorenzini, Yogendra Joshi, Abel Hernandez-Guerrero, J. Luis Luviano-Ortiz
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. April 2021, 143(4): 044502.
Paper No: HT-20-1769
https://doi.org/10.1115/1.4049639
Published Online: February 2, 2021
View Article titled, Parametric Analysis of Microfluidic Cooling Systems for Three-Dimensional-Stacked Silicon Microelectronics by Inferential Statistic Approaches
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Topics: Computer simulation, Cooling systems, Density, Experimental design, Heat, Microfluidics, Pressure drop, Silicon, Temperature, Fins
Journal Articles

A Review of Thermo-Hydraulic Performance of Metal Foam and Its Application as Heat Sinks for Electronics Cooling

Yongtong Li, Liang Gong, Minghai Xu, Yogendra Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. September 2021, 143(3): 030801.
Paper No: EP-19-1124
https://doi.org/10.1115/1.4048861
Published Online: January 19, 2021
View Article titled, A Review of Thermo-Hydraulic Performance of Metal Foam and Its Application as Heat Sinks for Electronics Cooling
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Topics: Heat sinks, Metal foams, Heat transfer
Journal Articles

Single Phase Liquid Cooling of High Heat Flux Devices With Local Hotspot in a Microgap With Nonuniform Fin Array

Yuanchen Hu, Thomas Sarvey, Muhannad S. Bakir, Yogendra Joshi
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. March 2021, 143(3): 031501.
Paper No: HT-20-1115
https://doi.org/10.1115/1.4049189
Published Online: January 18, 2021
View Article titled, Single Phase Liquid Cooling of High Heat Flux Devices With Local Hotspot in a Microgap With Nonuniform Fin Array
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Topics: Cooling, Design, Flow (Dynamics), Heat flux, Hydrofoil, Pressure drop, Temperature, Coolants, Fins, Heat transfer coefficients
Proceedings Papers

Validation and Parametric Investigations Using a Lumped Thermal Parameter Model of an Internal Permanent Magnet Motor

Sebastien Sequeira, Kevin Bennion, J. Emily Cousineau, Sreekant Narumanchi, Gilbert Moreno, Satish Kumar, Yogendra Joshi
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A002, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2550
https://doi.org/10.1115/IPACK2020-2550
View Paper titled, Validation and Parametric Investigations Using a Lumped Thermal Parameter Model of an Internal Permanent Magnet Motor
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Topics: Electric motors, Engines, Finite element analysis, Motors, Permanent magnets, Sensitivity analysis, Thermal management
Journal Articles

Packaging Environmental Sensors for Monitoring Urban-Microclimates

Shuv Dey, J. Michael Brown, Yogendra Joshi
Journal: ASME Journal of Engineering for Sustainable Buildings and Cities
Publisher: ASME
Article Type: Research Papers
J. Eng. Sustain. Bldgs. Cities. August 2020, 1(3): 031001.
Paper No: JESBC-20-1004
https://doi.org/10.1115/1.4047422
Published Online: June 18, 2020
View Article titled, Packaging Environmental Sensors for Monitoring Urban-Microclimates
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Topics: Packaging, Sensors, Design
Journal Articles

Thermal Performance of Metal Foam Heat Sink With Pin Fins for Nonuniform Heat Flux Electronics Cooling

Yongtong Li, Liang Gong, Minghai Xu, Yogendra Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2021, 143(1): 011006.
Paper No: EP-19-1100
https://doi.org/10.1115/1.4046756
Published Online: June 4, 2020
View Article titled, Thermal Performance of Metal Foam Heat Sink With Pin Fins for Nonuniform Heat Flux Electronics Cooling
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Topics: Heat flux, Heat sinks, Metal foams, Heat transfer, Temperature, Fluids
Journal Articles

Vandal Glass Heat Distribution and the Effect of Glass Gap Adjustments in Outdoor Digital Display Components

Jeho Kim, J. Michael Brown, Yogendra Joshi, Kevin O'Connor, Marcos Diaz, Zhuomin Zhang, Peiyan Yang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031120.
Paper No: EP-19-1127
https://doi.org/10.1115/1.4046933
Published Online: May 4, 2020
View Article titled, Vandal Glass Heat Distribution and the Effect of Glass Gap Adjustments in Outdoor Digital Display Components
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Topics: Glass, Heat, Manufacturing, Solar energy, Solar radiation, Temperature, Testing, Simulation, Liquid crystals, Computational fluid dynamics
Journal Articles

Predictive Model Development and Validation for Raised Floor Plenum Data Center

Yogesh Fulpagare, Atul Bhargav, Yogendra Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2020, 142(2): 021009.
Paper No: EP-18-1078
https://doi.org/10.1115/1.4046554
Published Online: March 19, 2020
View Article titled, Predictive Model Development and Validation for Raised Floor Plenum Data Center
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Topics: Computational fluid dynamics, Data centers, Temperature, Testing, Transients (Dynamics), Heat, Stress